destroyer
2022-08-10T13:54:03+00:00
[url]https://semianalysis.com/2022-nand-process-technology-comparison-chinas-ymtc-shipping-densest-nand-chips-4-alliance-long-term-financial-outlook/[/url]
很长的英文报告，看样子是前两天世界存储技术大会后发表的
截取其中几段：
我们的结论是：美光，海力士，长存领跑。其它几个落后了，尤其是三星，还在用好几年前的技术
[quote]In this report, we want to conduct a status check on process technology from Samsung, SK Hynix, Micron, Solidigm, YMTC, Western Digital, and Kioxia. The quick summary is that Micron, SK Hynix, and YMTC are racing ahead of the others. At the same time, Samsung has oddly fallen behind despite being the absolute leader in NAND technology just a few years ago.
[img]https://img.nga.178.com/attachments/mon_202208/15/9aQ2q-j5ciZgT3cSow-ie.jpg[/img]
[/quote]长存对于他们的最新进展很低调，官方除了宣传 Xtacking 3.0是目前业界密度最高的架构以外，并没有说更多的东西。我们认为长存是想隐藏自己的技术实力，以免吸引更多的美国制裁，与中芯不宣布7nm流片成功一个道理
[quote]YMTC has been very coy with their new generation of NAND, marketed as Xtacking 3.0. They will not officially say the layer counts anywhere. The official line does not go beyond marketing Xtacking 3.0 as the industry’s densest 1Tb TLC NAND. We imagine YMTC wants to hide this technical detail because they fear US sanctions. Many allegories can be drawn to SMIC’s concealment of their 7nm technology and high volume ramp of 14nm. It makes sense that YMTC is being coy in that context.[/quote]我们通过与拆解半导体研究Angstronomics合作，证实了长存芯片的物理参数。长存的员工还告诉了我们出货的具体时间
[quote]We established these facts by measuring a physical die with the virtual help of Angstronomics. Having access to the physical die also allowed us to confirm that it is 6-planes. We also further details by talking to employees on and off the record. We spent so much time with them at the booth that they even asked us to take the company photo. We found their new NAND packaged in SSDs at a 3rd party Taiwanese company’s booth. They were happy to tell us some other details, including shipment timing.
[img]https://img.nga.178.com/attachments/mon_202208/15/9aQ2q-bxqwZ29T3cS2n0-1yc.jpg[/img]
[/quote]三星虽然在2021年就宣称开始出货178层产品了，但是迄今为止，没有任何半导体拆解研究机构发现过128层以上的三星产品
[quote]Despite leading at 128-layer, Samsung has not shipped a new NAND process technology in years. Their 176-layer and >200-layer NAND process technologies have not been found in any SSDs by reverse engineering firms or teardowns. This is despite their claims of shipping 176-layer consumer SSDs in 2021.[/quote]
很长的英文报告，看样子是前两天世界存储技术大会后发表的
截取其中几段：
我们的结论是：美光，海力士，长存领跑。其它几个落后了，尤其是三星，还在用好几年前的技术
[quote]In this report, we want to conduct a status check on process technology from Samsung, SK Hynix, Micron, Solidigm, YMTC, Western Digital, and Kioxia. The quick summary is that Micron, SK Hynix, and YMTC are racing ahead of the others. At the same time, Samsung has oddly fallen behind despite being the absolute leader in NAND technology just a few years ago.
[img]https://img.nga.178.com/attachments/mon_202208/15/9aQ2q-j5ciZgT3cSow-ie.jpg[/img]
[/quote]长存对于他们的最新进展很低调，官方除了宣传 Xtacking 3.0是目前业界密度最高的架构以外，并没有说更多的东西。我们认为长存是想隐藏自己的技术实力，以免吸引更多的美国制裁，与中芯不宣布7nm流片成功一个道理
[quote]YMTC has been very coy with their new generation of NAND, marketed as Xtacking 3.0. They will not officially say the layer counts anywhere. The official line does not go beyond marketing Xtacking 3.0 as the industry’s densest 1Tb TLC NAND. We imagine YMTC wants to hide this technical detail because they fear US sanctions. Many allegories can be drawn to SMIC’s concealment of their 7nm technology and high volume ramp of 14nm. It makes sense that YMTC is being coy in that context.[/quote]我们通过与拆解半导体研究Angstronomics合作，证实了长存芯片的物理参数。长存的员工还告诉了我们出货的具体时间
[quote]We established these facts by measuring a physical die with the virtual help of Angstronomics. Having access to the physical die also allowed us to confirm that it is 6-planes. We also further details by talking to employees on and off the record. We spent so much time with them at the booth that they even asked us to take the company photo. We found their new NAND packaged in SSDs at a 3rd party Taiwanese company’s booth. They were happy to tell us some other details, including shipment timing.
[img]https://img.nga.178.com/attachments/mon_202208/15/9aQ2q-bxqwZ29T3cS2n0-1yc.jpg[/img]
[/quote]三星虽然在2021年就宣称开始出货178层产品了，但是迄今为止，没有任何半导体拆解研究机构发现过128层以上的三星产品
[quote]Despite leading at 128-layer, Samsung has not shipped a new NAND process technology in years. Their 176-layer and >200-layer NAND process technologies have not been found in any SSDs by reverse engineering firms or teardowns. This is despite their claims of shipping 176-layer consumer SSDs in 2021.[/quote]