Dejoura
2021-08-18T16:20:38+00:00
太长不看 ...
只要不是IO朝上吊装怎么都行
测试旁平台为开放式平台
测试使用显卡:映众3070Ti黑金至尊
内部散热模块结构拆解图
[img]https://img.nga.178.com/attachments/mon_202108/22/9aQcy9f-hjg8ZbT1kShs-au.jpeg[/img]
显卡刷BIOS解除了功耗墙 定压0.9V 核心定频1905Mhz 显存默认19GHz 风扇拉满
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQ7kew-586gK2jT3cSlj-eq.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa829-7p14ZbT3cSsh-nl.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa82a-7qztZcT3cSxg-ow.jpg[/img]
使用Fumark烤机直至温度稳定 设定如图
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQ7kgp-ib1qZvT3cSyi-iw.jpg[/img]
功耗稳定在300W
使用空调和加湿器将环境温度稳定在25摄氏度 相对湿度60%
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQcy9h-lf9qK1bT1kShs-12h.jpg[/img]
接下来是测试结果
五种不同的体位,变量为进风方向和热管朝向
显卡竖装
侧面进风,热管冷凝端一半些微高出蒸发端,一半些微低于蒸发端
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa82v-3o09ZlT3cSsg-lc.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQcy9i-f0roK18T1kSe6-6l.jpg[/img]
核心66.1
显卡平装
下方进风,热管冷凝端全部些微低于蒸发端
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa839-12srZlT3cSsg-lc.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQ7kvc-d1kdK1aT1kSe3-6m.jpg[/img]
核心67.5
显卡倒装
上方进风,热管冷凝端全部些微高出蒸发端
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQcy9j-bc8bZiT3cSlc-sg.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQcy9j-9lofK18T1kSe8-6c.jpg[/img]
核心66.0
显卡吊装(IO朝下)
侧面进风,热管冷凝端大部分高出蒸发端200mm,少部分些微低于蒸发端
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQ7l1h-hr4aZdT3cSlc-sg.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa83o-gyx7K18T1kSe8-6o.jpg[/img]
核心65.5
显卡吊装(IO朝上)
侧面进风,热管冷凝端大部分低于蒸发端200mm,少部分些微高出蒸发端
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQ7l3o-2en2ZdT3cSlc-sg.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202108/23/9aQa83t-21nvK1bT1kSeb-6m.jpg[/img]
核心87.3 过热降频
得出结论:
冷空气下降和热空气上升的自然对流在风扇面前可以忽略不计
重力对热管内冷凝液的回流存在影响,且冷凝端低于蒸发端越多影响越大