Maid sama
2021-06-22T04:44:02+00:00
先說看看就好,別買,不推薦屏蔽嘉,只是規格還是得關注下
X570最差勁的問題在缺少4槽M2,說pcie4.0有用卻空著產品線不補齊,被後來的B550和Z590追著吊捶
X570S AM
鰭片式VRM散熱,屏蔽嘉老慣例了,這次對鋁片做消光噴砂處理
B550AP和AM都有使用鰭片,單純噴漆,其中AP只有左側的散熱片是鰭片,上方為鋁塊
映泰Z590女武神也有使用,不過還有加兩顆風扇,做成主動式鰭片散熱
其他板廠大多還在玩鋁塊
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-54g2Z2kT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-47t9Z1rT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-j391Z2cT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-ts7Z18T3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-dusqZ1vT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-2oscZ1bT3cS2yo-1o0.jpg.medium.jpg[/img]
B550AM和B550太極皆有的背板
但B550 Unify/B550E XE/C8DH沒有背板
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-12vuZ20T3cS2yo-1o0.jpg.medium.jpg[/img]
四槽pcie4.0 M2
B550AM只有三槽,X570S AM四槽
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-ducbZ1qT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-jfprZtT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-9irZqT3cS2yo-1o0.jpg.medium.jpg[/img]
X570S AG
沒背板,內存槽金屬加固被拔,白化面積有點血尿,都推出白色系列了,至少鋁塊別上色阿不懂在想甚麼
除非對TB有需求,或是價格和X570S AM拉開差距不然沒什麼看點
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-44vyZuT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-3c5pZ1fT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-83gvZ1jT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-8yvqZ1uT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-azp6Z2eT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-f5boZ24T3cS2yo-1o0.jpg.medium.jpg[/img]
鰭片散熱對比鋁塊有更高的上限,儘管AM4積熱確實無所謂那幾度,Z590那邊差距較大
屏蔽嘉跟華擎給主板上背板也輔助VRM背面PCB散熱,評測出來溫差確實頂
華擎的B550太極由於本身供電規模稍差,並且鋁塊面積小導致跟普通主板拉不出差距
當前主板的CPU供電規模已經溢出,轉換率接近,供多少電VRM就發出多少熱,散熱瓶頸在VRM散熱片上,AM4尤其適用
B560那邊供電並不比B550差但CPU功耗遠超AM4上限,各家方案差距就大了,在這邊先不談
此表可對照主板用料與VRM散熱片拆解服用,知其橫測造成溫度差距的理由
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-5mo1ZiT3cS1kw-vx.jpg.medium.jpg[/img]
X570最差勁的問題在缺少4槽M2,說pcie4.0有用卻空著產品線不補齊,被後來的B550和Z590追著吊捶
X570S AM
鰭片式VRM散熱,屏蔽嘉老慣例了,這次對鋁片做消光噴砂處理
B550AP和AM都有使用鰭片,單純噴漆,其中AP只有左側的散熱片是鰭片,上方為鋁塊
映泰Z590女武神也有使用,不過還有加兩顆風扇,做成主動式鰭片散熱
其他板廠大多還在玩鋁塊
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-54g2Z2kT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-47t9Z1rT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-j391Z2cT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-ts7Z18T3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-dusqZ1vT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-2oscZ1bT3cS2yo-1o0.jpg.medium.jpg[/img]
B550AM和B550太極皆有的背板
但B550 Unify/B550E XE/C8DH沒有背板
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-12vuZ20T3cS2yo-1o0.jpg.medium.jpg[/img]
四槽pcie4.0 M2
B550AM只有三槽,X570S AM四槽
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-ducbZ1qT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-jfprZtT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-9irZqT3cS2yo-1o0.jpg.medium.jpg[/img]
X570S AG
沒背板,內存槽金屬加固被拔,白化面積有點血尿,都推出白色系列了,至少鋁塊別上色阿不懂在想甚麼
除非對TB有需求,或是價格和X570S AM拉開差距不然沒什麼看點
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-44vyZuT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-3c5pZ1fT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-83gvZ1jT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-8yvqZ1uT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-azp6Z2eT3cS2yo-1o0.jpg.medium.jpg[/img]
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-f5boZ24T3cS2yo-1o0.jpg.medium.jpg[/img]
鰭片散熱對比鋁塊有更高的上限,儘管AM4積熱確實無所謂那幾度,Z590那邊差距較大
屏蔽嘉跟華擎給主板上背板也輔助VRM背面PCB散熱,評測出來溫差確實頂
華擎的B550太極由於本身供電規模稍差,並且鋁塊面積小導致跟普通主板拉不出差距
當前主板的CPU供電規模已經溢出,轉換率接近,供多少電VRM就發出多少熱,散熱瓶頸在VRM散熱片上,AM4尤其適用
B560那邊供電並不比B550差但CPU功耗遠超AM4上限,各家方案差距就大了,在這邊先不談
此表可對照主板用料與VRM散熱片拆解服用,知其橫測造成溫度差距的理由
[img]https://img.nga.178.com/attachments/mon_202106/23/9aQ2o-5mo1ZiT3cS1kw-vx.jpg.medium.jpg[/img]